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Connector, S8B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://datasheet.lcsc.com/lcsc/2303241700_Zetta-ZDSD64GLGEAG-R_C5277948.pdf#page=17), generated with kicad-footprint-generator Molex Pico-EZmate series connector, 14111013002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PH series connector, B3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 52 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_52_05-08-1729.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 1 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-794071-x, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-105-xx.x-x-DV-N, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xxx-DV-BE-A, 28 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-4)), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42819-22XX, With thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf.

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