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BackSee https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size.
- Normal -0.297024 -0.135125 0.945261 facet.
- -3.549011e-001 0.000000e+000 vertex -4.621885e+000.
- Type-1 TO-220-9, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1.
- Size 36x8.3mm^2, drill diamater 1.2mm, pad.