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200528-0050, 5 Circuits (https://www.molex.com/pdm_docs/sd/2005280050_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1210, with PCB cutout, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.2x2.2mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5989350/BP%20104%20FAS_EN.pdf PhotoDiode, plastic SMD DIL, 4.5x4mm² PhotoDiode plastic SMD SmatDIL Resistor, LDR 5.1x3.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Resistor, LDR 5x4.1mm, see http://cdn-reichelt.de/documents/datenblatt/A500/A90xxxx%23PE.pdf Resistor, LDR 5.1x3.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Resistor, LDR 12x10.8mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS485 IS486 package for diode bridges, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 12x-dip-switch SPST , Piano, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing.

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