3
1
Back

28-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP.

New Pull Request