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Hand-soldering TSOT, 8 Pin (https://www.st.com/resource/en/datasheet/ld1086.pdf#page=35), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-06A1, example for new mpn: 39-28-918x, 9 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 20 Pin (JEDEC MO-153 Var BE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-BE, 22 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic DFN (5mm x 5mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 28 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (https://media-www.micron.com/-/media/client/global/documents/products/data-sheet/nor-flash/serial-nor/mt25q/die-rev-a/mt25q_qljs_u_256_aba_0.pdf#page=22), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-14DP-0.5V, 14 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70 JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB locator, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST.

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