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JTOS PL-005 Footprint for Mini-Circuits case MMM168, Land pattern PL-094, pads 5 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-079, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for the sake of code complexity. Odd values are -=1 } module railSet(height) { railWithHoles(height); module railSupportSet(height) { railSupportCavity(height); 3D.

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