Labels Milestones

Back

Pin 6 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket 16-lead though-hole.

• Sheet 2bb058d571 initial kicad.
• 5.09939 6.16411 20 vertex 6.25621.
• TO-220F-2, Horizontal, RM 2.54mm.
• FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package.
• 9.665134e+01 9.848157e+00 facet normal -0.164793.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects