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Back# Additional ignored # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main afea9d5a2cf23e2a33a2927086270d4d602f5a2b Final revision; added custom DRC as project file attr exclude_from_pos_files exclude_from_bom) Final revision; added custom DRC as project file tstamp a19ef654-a631-44b9-8b6b-999333495c1b) Final revision; added custom DRC as project file polygon (pts Final revision; added custom DRC as project file (pts Final revision; added custom DRC as project file new_footprints Added hard sync to schematic, laid out PCB with on-board antenna Class 2 Bluetooth Module without antenna Low-Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf LoRa Low Power Long Range LoRa Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin SIM connector for 1.6mm PCB's with 05 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge.
- SIL reed relais Finder 32.21-x300 Relay.
- 19x19mm package, 0.8mm pitch.
- Length*diameter=24*7.5mm^2, Fastron, MESC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_MESC.pdf Inductor Axial series.