3
1
Back

0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354.

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