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SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 5.08mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 6.15 mm (242 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST .

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