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0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://www.diodes.com/assets/Datasheets/PAM8403.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/5-V-5.0-EX Terminal Block, 1732580 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732580.

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