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WLCSP-25, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZR pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, area grid, NSMD.

• 3.73603e-06 vertex 1.75966 2.86429.
• -1.026086e-14 facet normal 0.989357.
• Hardware/PCB/precadsr_Gerbers/precadsr-F_Paste.gbr create mode 100644.
• Main synth_tools/Schematics/SynthMages.pretty/6.3mm_NPTH_MAXJLCPCB.kicad_mod 24 lines Binary.

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