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Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78HB-0.5L, SIP-3, Horizontally Mounted, pitch 2.54mm, hole diameter 0.7mm.

• -1.092338e+02 9.665134e+01 1.188234e+01 facet normal 0.111478 -0.367773 0.923209.
• "" }, "schematic": { "annotate_start_num": 0, "drawing": .
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