Labels Milestones
Back7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch.
- Vertex -4.35153 -4.6363 7.51116.
- Pitch 8.00mm diameter 4.064mm.
- Capacitance between traces - .3mm.
- Https://learn.adafruit.com/adafruit-feather/feather-specification Footprint for Mini-Circuits case HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf.