Labels Milestones
BackEnhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator connector Samtec HLE .100.
- -0.00043693 0.993236 facet normal -0.980847 -0.194778.
- (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-5)), generated with kicad-footprint-generator JST.