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3x3 array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP-UQ, 10 Pin (https://www.st.com/resource/en/datasheet/lps22hh.pdf#page=55), generated with kicad-footprint-generator JST XA series connector, LY20-26P-DLT1, 13 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator JST PH series connector, B12B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-45S-0.5SH, 45 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MF) - 6x5 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 2.54mm staggered type-1 TO-220-5, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 2.54mm TO-220-3, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 2.286mm SIPAK Vertical RM 10.9mm TO-264-3, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html.

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