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THT/SMD hybrid, 0.4mm pitch, 19 ckt, right angle stacked dual USB 3.0, type A, right angle tact switch https://www.e-switch.com/system/asset/product_line/data_sheet/148/TL1250.pdf led push switch right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf hdmi micro type d right angle 3mm lightpipe dual tower right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf hdmi micro type d right angle tht HDMI, Micro, Type D, THT, 0.4mm pitch, 19 ckt, right angle USB TYPE C, RA RCPT PCB, SMT, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401610E4%7e2A USB C Type-C Receptacle USB2.0 USB Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 and PD, 5A VBUS rating, https://datasheet.lcsc.com/lcsc/2211161000_HCTL-HC-TYPE-C-16P-01A_C2894897.pdf USB 3.0 3.1 3.2 4.0 Type-C receptable, through-hole mount, SMD, right-angle (http://en.connfly.com/static/upload/file/pdf/DS1104-01.pdf USB 3.0 type A right angle Surface-mount DC Barrel Jack, 2.0mm ID, 5.5mm OD, 24V, 8A, no switch, https://www.cui.com/product/resource/pj-063ah.pdf barrel jack cui dc power Wuerth electronics 9774090982 (https://katalog.we-online.de/em/datasheet/9774090982.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-1470 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xx-DV-PE-LC, 46 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 16 Pin package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin.

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