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BackPart number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 1x29 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x07 1.00mm single row Through hole angled pin header, 1x02, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC box.
- 7.3x6.6x1.2mm, https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf Inductor, Chilisin, BMRB00060612.
- LongPads 18-lead though-hole mounted DIP package, row spacing.
- 6.89798 vertex 0.567807 7.3441.