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2 copper strip SMD 2x03 1.27mm double row Through hole Samtec HPM power header series 3.81mm post length THT 1x03 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x21 1.00mm single row Surface mounted pin header THT 2x20 1.27mm double row Through hole angled pin header THT 2x13 1.27mm double row Through hole pin header THT 1x29 2.00mm single row Through hole angled socket strip SMD 2x02 2.54mm double row Through hole straight socket strip, 1x31, 2.54mm pitch, double rows Through hole angled pin header THT 1x11 2.00mm single row Surface mounted pin header THT 2x31 1.27mm double row surface-mounted straight pin header, 2x01, 1.27mm pitch, double rows Through hole straight Samtec HPM power header series 11.94mm post length, 1x06, 5.08mm pitch, single row style2 pin1 right Through hole IDC header, 2x12, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x20, 2.54mm pitch, double rows Through hole pin header THT 1x22 2.54mm single row Through hole angled pin header, 2x13, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x08 1.27mm single row style2 pin1 right Through hole straight socket strip, 1x07, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip, 1x14, 1.27mm pitch, single row male, vertical entry Harwin LTek Connector, 44 pins, surface mount PLCC, 68 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST XA series connector, BM09B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xxx-DV-BE-A, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PH series connector, SM05B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 68 pins, surface mount PLCC, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (JEDEC MO-153 Var AB-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-26P-DLT1, 13 Circuits (https://www.molex.com/pdm_docs/sd/2005280130_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package - 9x9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE.

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