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(see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator JST VH series connector, 53261-0471 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-LC, 22 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside.

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