Labels Milestones
BackSocket 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile.
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X="8.0" y="4.6"/>
1x22 2.00mm single row. - 4.371905e-001 8.639750e-001 vertex -3.464629e+000.
- Taiyo Yuden, MD series, Taiyo-Yuden_MD-2020, 2.0mmx2.0mm.