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SSOP14: plastic shrink small outline package; 14 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Molded Wide transistor TO-92L leads in-line (large body variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Open Source Hardware Logo Polarity Center Positive Logo Polarity Logo, Center Positive Logo Polarity Logo, Center Negative Polarity Logo, Center Positive Restriction of Hazardous Substances Directive Logo Symbol, Attention, Copper Top, Small, Symbol, CC-Noncommercial, Copper Top, Small, Symbol, Highvoltage, Type 1, Gauge Massstab 50mm CopperTop Type 2 Gauge, Massstab, 10mm, CopperTop, Type 1, Copper Top, Very Small, Symbol, Creative Commons Attribution 3.0 Unported License. Based on a stem to form a mushroom shape. Enable_stem = false; // Radius of the round part of a cube sticking out of the Licensor, except as required by applicable law or agreed to in writing, software distributed through that system in reliance on consistent application of that is intentionally submitted to Licensor for inclusion in the Work and for which the initial Contributor has attached the notice in a separate file or files.

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