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1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip THT 1x23 2.00mm single row Through hole angled pin header SMD 2x16 2.00mm double row Through hole pin header SMD 2x22 1.27mm double row surface-mounted straight socket strip, 1x18, 2.54mm pitch, 6mm pin length, single row Surface mounted pin header SMD 1x28 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x21 2.00mm single row (from Kicad 4.0.7!), script generated Through hole straight socket strip, 1x29, 2.54mm pitch, double rows Through hole pin header SMD 1x22 1.27mm single row style2 pin1 right Through hole pin header SMD 1x12 2.54mm single row style2 pin1 right Through hole socket strip SMD 1x29 1.00mm single row Surface mounted socket strip SMD 2x07 2.54mm double row Through hole pin header THT 2x23 1.27mm double row Through hole socket strip SMD 1x15 2.54mm single row Through hole socket strip THT 1x38 2.54mm single row Through hole pin header SMD 1x03 1.27mm single row Through hole angled pin header SMD 1x31 2.54mm.

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