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Heat conduction during soldering ground plane created pull request synth_mages/MK_VCO#4 24955050f1 Merge pull request 'Put title box in PDF export' (#4) from schematic by Eeschema 5.1.9-73d0e3b20d~88~ubuntu20.04.1 Generated from schematic into main Merge pull request synth_mages/MK_VCO#4 24955050f1 Merge pull request synth_mages/MK_SEQ#2 b77534e3fc Added schmancy pcb for v1 front panel 24ca7abc85681936397a2802c8155420fcaf679c Added schmancy pcb for v2 front panel design and includes 2.5mm centerward shift for input and output jacks row_2 = row_1 + vertical_space/7; row_6 = row_5 + vertical_space/7; row_4 = row_3 + vertical_space/7; cv_in_1a = [left_col, row_1, 0]; left_rib_x = thickness * 1; //right_rib_x = width_mm - h_margin; input_column.

Https://www.neutrik.com/en/product/nc3mbv-e B Series, 5 pole.
Socket 6-lead though-hole mounted DIP package.
(https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf6025_en.pdf Inductor, TDK, SLF6028, 6.0mmx6.0mm (Script generated.
C&K Components SPST SMD.
Https://www.neutrik.com/en/product/nc3maah-1 AA Series, 3 pole.

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