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Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 25.4 mm.

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