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RM 5.08mm TO-126-2, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276), generated with kicad-footprint-generator JST PH series connector, S09B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 5.25mm 206mil JPin SMD 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size.

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