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ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBJ0008 pad definition.

• HLE-139-02-xxx-DV-BE-A, 39 Pins per row.
• Mount OR: | | S2.
• 166.31 121.975 (end 170.12 120.37 (end 165.75 119.5.
• Normal 2.570089e-001 -4.389334e-001 8.609785e-001 vertex.

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