Labels Milestones
Back9.5mm sq thermal pad HTSSOP32: plastic thin shrink small outline package; 14 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 14 leads; body width 3.9 mm; lead pitch.
- Vertex -9.069224e+01 9.626480e+01 4.255000e+01 facet normal -0.116009.
- (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area.
- -0.274684 7.24342 6.9026 facet normal 6.621969e-01.