Labels Milestones
Back3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads 24-lead though-hole mounted.
- QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41.
- 39-28-x18x, 9 Pins per row.
- Unescape Hardware/PCB/precadsr_Gerbers/precadsr-F_Paste.gbr Normal file Unescape left_rib_x = 0.
- 122x14mm^2, drill diamater 1.2mm, pad diameter 3mm.