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27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight pin header, 2x14, 2.54mm pitch, 6mm pin length, double rows Through hole IDC header, 2x08, 1.27mm pitch, double rows Surface mounted pin header THT 2x07 2.00mm double row surface-mounted straight pin header, 2x05, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x35 1.00mm single row male, vertical entry Harwin LTek.

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