synth_tools

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Body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 8 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline (SO) - Wide, 7.50 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc7593.pdf (page 432)), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B9B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, LY20-30P-DT1, 15 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0290, 29 Circuits (https://www.molex.com/pdm_docs/sd/2005280290_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-LC, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xx-DV-TE, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0230, 2 Pins.

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