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BackCLK out - could be other values, ceramic may work, test debouncing. Maybe enlarge footprint if needed. Subject: [PATCH 11/13] more fixes dcaec240831d28b722a7d7988287c76a1461e439 glide fix a5c5ff12ce18fecaaf346f973863d12bf361ac82 Notes from debugging More notes C10, C14 too small for a single 2 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf TDFN, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator Molex KK-254.
- -4.349508e-001 8.639734e-001 facet normal -8.577355e-001 -4.200345e-003.
- (https://katalog.we-online.com/em/datasheet/9775116960.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44.
- System, 55932-1310, with PCB locator, 13 Pins per.