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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AA), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/229321fa.pdf#page=27), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001839B.pdf#page=464), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ with flat fork, hole diameter 1.0mm, hole diameter 1.3mm, wire diameter 1.0mm Keystone Miniature THM Test Point 5005-5009, http://www.keyelco.com/product-pdf.cfm?p=1314 Keystone Miniature THM Test Point 5000-5004, http://www.keyelco.com/product-pdf.cfm?p=1309 Through Hole 10/100 Base-T, Cetus, used and distributed by WIZnet (https://wizwiki.net/wiki/lib/exe/fetch.php?media=products:wiz550web:wiz550webds_kr:j1b1211ccd.pdf 10/100Base-T RJ45 ethernet connector with transformer and POE (https://abracon.com/Magnetics/lan/ARJP11A.PDF ethernet 8p8c transformer poe rj45 8 Pol Shallow Latch Connector, Modjack, RJ45 (https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/c-bmj-0102.pdf Shielded, 2 LED, https://www.amphenolcanada.com/ProductSearch/drawings/AC/RJHSE538X.pdf RJ45 8p8c dual ethernet cat5 1 Port RJ45 8P8C receptacle, shielded, with magnetics, through hole, DF13-09P-1.25DS, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Micro Small Outline (ST)-4.4 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-144-02-xxx-DV-BE-LC, 44 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-28S-0.5SH, 28 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2106, With thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105310-xx10, 5 Pins per row (https://www.hirose.com/fr/product/document?clcode=CL0580-2218-5-05&productname=FH41-30S-0.5SH(05)&series=FH41&documenttype=2DDrawing⟨=fr&documentid=0001001704 connector Hirose DF13.

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