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1x23 2.00mm single row Through hole vertical IDC header THT 1x05 1.00mm single row Through hole angled pin header SMD 1x10 1.00mm single row Through hole straight socket strip, 2x21, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip SMD 1x38 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x32 1.27mm double row surface-mounted straight pin header, 1x11, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x19, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box header THT 1x06 2.54mm single row Through hole angled pin header SMD 1x03 2.54mm single row style2 pin1 right Through hole angled pin header THT 1x26 1.27mm single row male, vertical entry, with latches, PN:G125-MVX3405L1X Harwin Gecko Connector, 26 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 34 pins, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 26 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body with Exposed Pad Variation BB; (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead.

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