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Land grid array Bosch LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 24 Pin (https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf), generated with kicad-footprint-generator connector JST GH series connector, S10B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-140 , 10 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator JST SH series connector, SM11B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Diode SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flatpack (PT) - 7x7x1.0 mm Body [HTSSOP], with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline No-Lead 8-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 6.73 mm.

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