Labels Milestones
Back225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas.
- Normal 3.4225e-05 -0.113199 0.993572 vertex 0.761333 7.32528 6.91193.
- Normal -0.665684 -0.586535 0.461347.
- (https://katalog.we-online.de/em/datasheet/9774050482.pdf), generated with kicad-footprint-generator Soldered wire.
- 17.3x14mm^2, drill diamater 1.3mm, pad diameter 3mm.