Labels Milestones
BackLongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm.
- -1.011997e-14 5.429241e-15 -1.000000e+00 d8eca8dc7e Go to file.
- MSTBV_2,5/15-GF-5,08; number of pins: 03.
- (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator Mounting Hardware, inside.