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CASE 505AB (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 7, Wuerth electronics 9771120360 (https://katalog.we-online.com/em/datasheet/9771120360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip THT 1x24 2.54mm single row Through hole angled pin header THT 1x19 2.54mm single row style2 pin1 right Through hole angled socket strip THT 1x26 2.00mm single row Through hole angled socket strip, 2x45, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header THT 2x07 2.54mm double row Through hole angled pin header THT 2x17 2.00mm double row surface-mounted straight pin header, 1x21, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled socket strip THT 2x27 2.00mm double row Through hole angled socket strip SMD 1x31 1.27mm single row Surface mounted socket strip THT 2x07 2.00mm double row surface-mounted straight socket strip, 2x23, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x25 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x21 2.00mm double row Through hole socket strip THT 1x10 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x19 2.00mm single row style2 pin1 right Through hole straight socket strip, 1x10, 2.00mm pitch, double rows Surface mounted pin header THT 2x08 2.00mm double row surface-mounted straight socket strip, 2x27, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x05, 2.54mm pitch, single row Through hole straight socket strip, 1x20, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x16 2.54mm double row surface-mounted straight socket strip, 1x36, 2.54mm pitch, DIN 41651 .

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