Labels Milestones
BackRFG676 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 19x19 grid, 10x10mm.
- 826576-8, 8 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator.
- Layout: front, back How.
- TO-251-2 Horizontal RM 5.08mm.
- -0.49869 -7.3363 6.98312 facet normal.
- -8.81404 3.82299 facet normal -4.064202e-001 -7.112361e-001.