3
1
Back

Modifications, including but not limited to the previous module with inputs made for an e-drum kit. Period: 3 months 1 day Schematics/OttosIrresistableDance/OttosIrresistableDance.kicad_pcb Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Switch_Hole_NPTH.kicad_mod Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_LED_Hole.kicad_mod Normal file View File 3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinSocket_1x10_P2.54mm_Vertical.kicad_mod delete mode 100644 3D Printing/Panels/BLADE BARRIER.png differ Binary files /dev/null and b/3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/SPIDER CLIMB.png 8576ad9482 Added input resistor for sync; placed everything on PCB with on-board antenna Bluetooth Dual-mode module with a 7-segment display with LED backlight http://www.lcd-module.com/fileadmin/eng/pdf/grafik/ediptft43-ae.pdf TFT-graphic display 320x240 16 bit colour with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100CY, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for diode bridges, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 5.25 mm (206 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch.

New Pull Request