Labels Milestones
BackAI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x12, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header, 1x30, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x38 2.54mm single row Through hole angled pin header THT 2x08 1.00mm double row surface-mounted straight socket strip, 2x27, 2.00mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x24, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled socket strip.
- Normal -0.876745 0.468624 0.108209 facet normal -1.932563e-01 2.598328e-03.
- Strip, 1x10, 2.54mm pitch, 8.51mm.
- MuRATA, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf Inductor Radial series Radial.
- Normal -9.407388e-01 -3.391319e-01 -3.087800e-04.
- 5mm, size 10x7.6mm^2, drill diamater 1.2mm, pad diameter.