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B13B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 112 pins, 20mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP 132 Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-142-02-xxx-DV-BE-LC, 42 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://sensirion.com/media/documents/C4B87CE6/627C2DCD/CD_DS_SCD40_SCD41_Datasheet_D1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA.

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