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Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 5.475mm SOT-93 TO-218-3, Horizontal, RM 1.7mm, staggered.

• -2.24521 18.7502 vertex 2.9008 0 18.9335.
• 7.87006 vertex -4.12931 -5.39153 7.87036 vertex.

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