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BackPitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.65mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.693x3.815mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, based on either internal or external clock sources cycle between 0v and 5v max // gate out (j4/j10) // clock in (j2/j11) // casc out (j14/j15 // reset/casc in (j1/j13) // gate out // cv out (j7/j6 // pause cv in (j18/j19 // 1 rotary switch, 5+ positions 6 sockets - One potentiometer for internal clock rate. Binary files /dev/null and b/SR 1.pdf differ Binary files /dev/null and b/Images/PXL_20210831_001017829.jpg differ Binary files /dev/null and b/3D Printing/AD&D 1e spell names in Filmoscope Quentin/BLADE BARRIER.png create mode 100644 Images/PXL_20210831_001017829.jpg create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/D_DO-35_SOD27_P7.62mm_Horizontal.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/D_DO-35_SOD27_P7.62mm_Horizontal.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Bourns_3296W_Vertical_screw_centered.kicad_mod delete mode 100644 Schematics/OttosIrresistableDance/OttosIrresistableDance.kicad_pcb create mode 100644 Schematics/Unseen Servant/Unseen Servant Front Panel v1.kicad_pcb Normal file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Female.stl Executable file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MOUTH.png main ENV/Envelope/Envelope.kicad_pro 333 lines LUTHERS_VCO.diy Executable file View File 3D Printing/Cases/Eurorack Modular Case/20210926_092147.jpg.
- 26-60-4040, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.
- (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline.
- Diameter 14mm Electrolytic Capacitor CP, Radial.
- Larger; MK uses a ground plane.
- 17.5x7.6mm^2 drill 1.2mm pad 3mm Terminal.