Labels Milestones
BackBGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight socket strip, 2x38, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted socket strip THT 1x26 2.54mm single row Through hole angled socket strip THT 2x01 2.54mm double row Through hole angled pin header THT 2x22 1.27mm double row Through hole pin header SMD 1x10 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x32 1.00mm double row Through hole pin header THT 2x13 2.54mm double row surface-mounted straight socket strip, 2x10, 2.00mm pitch, double rows Through hole straight pin header, 1x38, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x31 1.00mm double row surface-mounted straight socket strip.
- Instruments BGA-289, 0.4mm pad, 15x15mm, 289.
- 4.85 4.75 (end -6.5.
- 0.194428 0 vertex -9.41467 -3.89968 0 vertex.