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0.4P CASE 932BH (see ON Semiconductor 506BU.PDF 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted pin header THT 2x26 1.27mm double row Through hole angled socket strip, 2x08, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x16, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x14, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x21 2.00mm single row Through hole angled socket strip THT 2x40 1.27mm double row Through hole angled pin header, 1x23, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole.

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