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Back0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8.
- [Holes] */ // Line segments for.
- Normal 8.191610e-001 3.647188e-003 5.735521e-001 vertex 5.089240e+000 -1.045546e+000 2.480400e+001.
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Package length=7.0mm, package width=2.5mm, 3.