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From 7022ad9ddb43c592e11528a5ae21edf443c088e4 Mon Sep 17 00:00:00 2001 Subject: [PATCH] 's take on FIREBALL VCO using AD&D 1e MM, DMG, and PHB. # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: unplated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/4 Merge pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 **Component Count:** 74 **Component Count:** 75 0 0 N N 1 F N DEF SW_SPST_Lamp SW 0 0 N N 1 F N DEF SW_Rotary4x3 SW 0 40 Y Y 1 F N DEF SW_DIP_x04 SW 0 40 Y N 2 N In normal position, loop is disconnected from trigger,\nnormalization is removed from gate jack, and\nsustain pot level is used. In loop position, loop\nis connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [HTSSOP], with thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST PH series connector, DF3EA-11P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-5010, 50 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Thick Film Chip Resistor Network, ROHM MNR32 (see mnr_g.pdf Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf Chip Resistor Network, ROHM MNR18 (see mnr_g.pdf SMT resistor net Bourns CAT16 series, 2 way SMT resistor net, Bourns CAT16 series, 4 way 3mm PLCC-2 PLCC-4 planar light pipe 1 way.

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