synth_tools

Back

Chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 456, 1.94x2.4mm, 20.

XP_POWER IHxxxxD DIP DCDC-Converter XP_POWER ITXxxxxSA, SIP.
(https://katalog.we-online.com/em/datasheet/9775051360.pdf), generated with kicad-footprint-generator.
0.08159,-0.069628 0.230661,-1.4e-6 0.08159,0.069628 0.233769,-0.1127053 -0.0037,-0.1071967 0.138592,-0.1739233.
8.577423e-001 4.200219e-003 5.140627e-001 facet normal -0.0754507.
SW_DP3T SW 0 40 Y N.

New Pull Request

Labels Milestones