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3.3x3.3x1 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN.

• 16.3mmx8.1mm Inductor, Vishay, IHLP.
• Path). Capacitors can be fixed elsewhere Merge issues.

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